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F a c i l i t y

  • 本實驗室儀器設備置於奈米中心及工程四館 R314B，下表為儀器清單

    (The table below shows the brief scheme of our equipment properties.)

Nano Facility Center ( N F C )

  • MOCVD (Aixtron, for oxide-based growth) (金屬氣相沉積機台)

 

  • Die Bonder (晶圓貼合機)

 

  • Ink Jet Printer (噴墨系統)

 

  • Thin Film Stress Measurement (薄膜應力量測儀)

 

  • Oxidation Furface (氧氣爐管)

 

  • Electrode Plating for Nickel and Silver (電鍍)

 

  • Laser Cutting Machine x2 (from Lextar Company) (雷射切割機)

 

  • Optorun for DBR (光學鍍膜機)

 

Engineering Building D R314B

  • Agilent 4155A (安捷倫 4155A 半導體量測儀)

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  • Agilent 4284 (安捷倫 4284 半導體電容量測儀)

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  • Agilent B1505 (安捷倫 B1505 新型半導體量測儀)

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  • SUSS Probe Station (SUSS 半導體量測探針台)

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  • Gas Sensor Measurement (Kuo Duen Tech) (氣體感測量測腔體)

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  • Photodetector Measurement (Deuterium Lamp) (光偵測器量測系統)

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  • Laser Lift-off (KrF Excimer Laser) (雷射磊晶膜撥離法)

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  • Gold Wire Ball Bonder (金線焊接機)

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  • ​UV Curing (UV 光源)

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